* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Frequency - Output 1 |
Frequency - Output 2 |
Function |
Output |
Voltage - Supply |
Frequency Stability |
Operating Temperature |
Current - Supply (Max) |
Size / Dimension |
Height |
Package / Case |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock5,346 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
25MHz, 50MHz, 125MHz, 150MHz |
100MHz, 156.25MHz |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock7,614 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
25MHz, 50MHz, 125MHz, 150MHz |
100MHz, 156.25MHz |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,248 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
25MHz, 50MHz, 125MHz, 150MHz |
100MHz, 156.25MHz |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,860 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,986 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock3,366 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock2,070 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock5,310 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock5,292 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock6,408 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock2,628 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock7,452 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock3,780 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock6,138 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS, LVPECL |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,896 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS, LVPECL |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock7,722 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS, LVPECL |
2.25 V ~ 3.6 V |
±50ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock3,852 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVCMOS, LVPECL |
2.25 V ~ 3.6 V |
±50ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock2,286 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,212 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,572 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock2,610 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,428 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock7,488 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,446 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,986 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVCMOS |
2.25 V ~ 3.6 V |
±50ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock6,084 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock3,600 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
HCSL, LVCMOS |
2.25 V ~ 3.6 V |
±25ppm |
-40°C ~ 85°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock5,724 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVPECL |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock3,762 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVPECL |
2.25 V ~ 3.6 V |
±50ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |
||
Microchip Technology |
OSC MEMS CONFIGURABLE OUTPUT
|
Package: 20-VFQFN Exposed Pad |
Stock4,302 |
|
20-VFQFN Exposed Pad |
DSC400 |
MEMS (Silicon) |
- |
- |
Enable/Disable |
LVPECL |
2.25 V ~ 3.6 V |
±25ppm |
-20°C ~ 70°C |
- |
0.197" L x 0.126" W (5.00mm x 3.20mm) |
0.035" (0.90mm) |
20-VFQFN Exposed Pad |