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Sockets for ICs, Transistors

Records 243
Page  1/9
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Assmann WSW Components
IC SOCKET 32 PIN MACH CONT
Package: -
Stock3,744
-
-
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 48POS GOLD
Package: -
Stock7,596
-
-
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 32POS GOLD
Package: -
Stock2,160
-
-
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 84POS TIN
Package: -
Stock4,716
-
-
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock8,946
-
-
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
Assmann WSW Components
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock4,428
-
-
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
-
-
Through Hole
Open Frame
-
-
-
-
-
-
-
Assmann WSW Components
CONN IC DIP SOCKET 22POS GOLD
Package: -
Stock6,786
-
-
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock3,384
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 68POS TIN
Package: -
Stock6,210
-
-
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 52POS TIN
Package: -
Stock7,362
-
-
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 44POS TIN
Package: -
Stock4,500
-
-
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 32POS TIN
Package: -
Stock7,596
-
-
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 28POS TIN
Package: -
Stock2,556
-
-
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 20POS TIN
Package: -
Stock4,176
-
-
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 84POS GOLD
Package: -
Stock7,632
-
-
PLCC
84 (4 x 21)
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 20POS GOLD
Package: -
Stock5,958
-
-
PLCC
20 (4 x 5)
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 84POS TIN
Package: -
Stock5,274
-
-
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 52POS TIN
Package: -
Stock5,202
-
-
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 32POS TIN
Package: -
Stock5,274
-
-
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 20POS TIN
Package: -
Stock2,178
-
-
PLCC
20 (4 x 5)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock2,358
-
-
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 64POS GOLD
Package: -
Stock6,174
-
-
DIP, 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock2,394
-
-
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock8,604
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock6,624
-
-
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock6,480
-
-
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock7,110
-
-
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock4,644
-
-
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock4,032
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock8,586
-
-
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C