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Sockets for ICs, Transistors

Records 157
Page  6/6
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Amphenol FCI
CONN IC DIP SOCKET 40POS TIN
Package: -
Stock41,388
-
-
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
Amphenol FCI
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock96,786
-
-
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
Amphenol FCI
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock56,160
-
-
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
Amphenol FCI
CONN IC DIP SOCKET 16POS TIN
Package: -
Stock116,790
-
-
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
Amphenol FCI
CONN IC DIP SOCKET 14POS TIN
Package: -
Stock104,868
-
-
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
Amphenol FCI
CONN IC DIP SOCKET 8POS TIN
Package: -
Stock233,664
-
-
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
Amphenol FCI
CONN SOCKET PLCC 44POS TIN
Package: -
Stock45,306
-
-
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-40°C ~ 105°C