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PMIC - Power Management - Specialized

Records 4886
Page  135/163
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Applications
Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
NXP
PF1510
Package: 40-VFQFN Exposed Pad
Stock6,704
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
PF1510
Package: 40-VFQFN Exposed Pad
Stock3,472
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
PF1510
Package: 40-VFQFN Exposed Pad
Stock3,024
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Package: -
Stock2,960
-
*
-
-
-
-
-
-
-
NXP
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Package: -
Stock3,904
-
*
-
-
-
-
-
-
-
NXP
IC TRANSCEIVER
Package: -
Stock7,120
-
*
-
-
-
-
-
-
-
NXP
IC TRANSCEIVER
Package: -
Stock5,408
-
*
-
-
-
-
-
-
-
NXP
POWER MANAGEMENT IC I.MX7 PRE-
Package: 48-VFQFN Exposed Pad
Stock4,752
48-VFQFN Exposed Pad
-
i.MX Processors
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
NXP
POWER MANAGEMENT IC I.MX7 PRE-
Package: 48-VFQFN Exposed Pad
Stock7,632
48-VFQFN Exposed Pad
-
i.MX Processors
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
NXP
POWER MANAGEMENT IC I.MX7 PRE-
Package: 48-VFQFN Exposed Pad
Stock6,080
48-VFQFN Exposed Pad
-
i.MX Processors
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
NXP
POWER MANAGEMENT IC I.MX7 PRE-
Package: 48-VFQFN Exposed Pad
Stock5,520
48-VFQFN Exposed Pad
-
i.MX Processors
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
NXP
POWER MANAGEMENT IC I.MX7 PRE-
Package: 48-VFQFN Exposed Pad
Stock2,944
48-VFQFN Exposed Pad
-
i.MX Processors
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
NXP
POWER MANAGEMENT IC I.MX7 PRE-
Package: 48-VFQFN Exposed Pad
Stock4,832
48-VFQFN Exposed Pad
-
i.MX Processors
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
NXP
POWER MANAGEMENT IC I.MX7 PRE-
Package: 48-VFQFN Exposed Pad
Stock4,048
48-VFQFN Exposed Pad
-
i.MX Processors
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
NXP
POWER MANAGEMENT IC I.MX7 PRE-
Package: 48-VFQFN Exposed Pad
Stock5,232
48-VFQFN Exposed Pad
-
i.MX Processors
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
NXP
POWER MANAGEMENT IC I.MX7 PRE-
Package: 48-VFQFN Exposed Pad
Stock4,560
48-VFQFN Exposed Pad
-
i.MX Processors
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
NXP
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Package: -
Stock5,952
-
*
-
-
-
-
-
-
-
NXP
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Package: -
Stock4,848
-
*
-
-
-
-
-
-
-
NXP
POWER MANAGEMENT IC I.MX7 PRE-
Package: 48-VFQFN Exposed Pad
Stock2,240
48-VFQFN Exposed Pad
-
Processor
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
NXP
PF1550
Package: 40-VFQFN Exposed Pad
Stock4,880
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
PF1550
Package: 40-VFQFN Exposed Pad
Stock3,920
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
PF1550
Package: 40-VFQFN Exposed Pad
Stock3,696
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
POWER MANAGEMENT IC: 3 BUCK REGS
Package: 40-VFQFN Exposed Pad
Stock7,088
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
POWER MANAGEMENT IC: 3 BUCK REGS
Package: 40-VFQFN Exposed Pad
Stock3,888
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Package: -
Stock6,480
-
*
-
-
-
-
-
-
-
NXP
BUCK/BOOST HS-CAN/DUAL LIN SYSTE
Package: -
Stock4,752
-
*
-
-
-
-
-
-
-
NXP
PF1510
Package: 40-VFQFN Exposed Pad
Stock7,840
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 85°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
PF1510
Package: 40-VFQFN Exposed Pad
Stock5,472
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 85°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
PF1510
Package: 40-VFQFN Exposed Pad
Stock7,056
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 85°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)
NXP
PF1510
Package: 40-VFQFN Exposed Pad
Stock5,472
40-VFQFN Exposed Pad
-
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
-
3.8 V ~ 7 V
-40°C ~ 85°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)