* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Memory Type |
Memory Format |
Technology |
Memory Size |
Memory Interface |
Clock Frequency |
Write Cycle Time - Word, Page |
Access Time |
Voltage - Supply |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
16MB SQI FLASH MEMORY
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,064 |
|
8-SOIC (0.154", 3.90mm Width) |
SST26 SQI® |
Non-Volatile |
FLASH |
FLASH |
16Mb (2M x 8) |
SPI - Quad I/O |
104MHz |
1.5ms |
- |
2.7V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
16MB SQI FLASH MEMORY
|
Package: 8-SOIC (0.209", 5.30mm Width) |
Stock5,472 |
|
8-SOIC (0.209", 5.30mm Width) |
SST26 SQI® |
Non-Volatile |
FLASH |
FLASH |
16Mb (2M x 8) |
SPI - Quad I/O |
104MHz |
1.5ms |
- |
2.7V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.209", 5.30mm Width) |
8-SOIJ |
||
Microchip Technology |
16MB SQI FLASH MEMORY
|
Package: 8-WDFN Exposed Pad |
Stock6,416 |
|
8-WDFN Exposed Pad |
SST26 SQI® |
Non-Volatile |
FLASH |
FLASH |
16Mb (2M x 8) |
SPI - Quad I/O |
104MHz |
1.5ms |
- |
2.7V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-WDFN Exposed Pad |
8-WDFN (5x6) |
||
Microchip Technology |
4MB SPI FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,048 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 105°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
4MB SPI FLASH 2X3 USON
|
Package: 8-UFDFN Exposed Pad |
Stock6,352 |
|
8-UFDFN Exposed Pad |
- |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 105°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-USON (2x3) |
||
Microchip Technology |
4MB SPI FLASH
|
Package: 8-WDFN Exposed Pad |
Stock6,688 |
|
8-WDFN Exposed Pad |
- |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 105°C (TA) |
Surface Mount |
8-WDFN Exposed Pad |
8-WDFN (5x6) |
||
Microchip Technology |
4MB SPI FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,672 |
|
8-SOIC (0.154", 3.90mm Width) |
SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
4MB SPI FLASH
|
Package: 8-WDFN Exposed Pad |
Stock2,448 |
|
8-WDFN Exposed Pad |
SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-WDFN Exposed Pad |
8-WDFN (5x6) |
||
Microchip Technology |
4MB SPI FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,696 |
|
8-SOIC (0.154", 3.90mm Width) |
SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
4MB SPI FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock4,240 |
|
8-SOIC (0.154", 3.90mm Width) |
SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 105°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
4MB SPI FLASH
|
Package: 8-WDFN Exposed Pad |
Stock4,320 |
|
8-WDFN Exposed Pad |
SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 105°C (TA) |
Surface Mount |
8-WDFN Exposed Pad |
8-WDFN (5x6) |
||
Microchip Technology |
4MB SPI FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,328 |
|
8-SOIC (0.154", 3.90mm Width) |
SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
4MB SPI FLASH
|
Package: 8-WDFN Exposed Pad |
Stock6,352 |
|
8-WDFN Exposed Pad |
SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-WDFN Exposed Pad |
8-WDFN (5x6) |
||
Microchip Technology |
4MB SPI FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,520 |
|
8-SOIC (0.154", 3.90mm Width) |
SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
2.7-5.5V 2MHZ IND TEMP 8-SOIC-N
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,680 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8, 1K x 16) |
SPI |
1MHz |
10ms |
- |
2.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
2MHZ AUTO GRADE 8-TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock4,000 |
|
8-TSSOP (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
4Kb (512 x 8, 256 x 16) |
SPI |
1MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
2MHZ AUTO GRADE 8-TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock7,136 |
|
8-TSSOP (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
2Kb (256 x 8, 128 x 16) |
SPI |
1MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock3,056 |
|
8-UFDFN Exposed Pad |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
2MHZ AUTO GRADE 8-SOIC-N
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock6,944 |
|
8-SOIC (0.154", 3.90mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
2Kb (256 x 8, 128 x 16) |
SPI |
1MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
5MHZ A-TMP 8-TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock2,816 |
|
8-TSSOP (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
128Kb (16K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
5MHZ A-TMP 8-TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock2,400 |
|
8-TSSOP (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
64Kb (8K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
5MHZ A-TMP 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,088 |
|
8-SOIC (0.154", 3.90mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
128Kb (16K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
5MHZ A-TMP 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock3,024 |
|
8-SOIC (0.154", 3.90mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
64Kb (8K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock4,208 |
|
8-UFDFN Exposed Pad |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
128Kb (16K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock6,592 |
|
8-UFDFN Exposed Pad |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
64Kb (8K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock2,624 |
|
8-UFDFN Exposed Pad |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
128Kb (16K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
5MHZ AUTO GRADE1 8-UDFN
|
Package: 8-UFDFN Exposed Pad |
Stock6,368 |
|
8-UFDFN Exposed Pad |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
64Kb (8K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-UDFN (2x3) |
||
Microchip Technology |
5MHZ A-TMP 8-TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock7,216 |
|
8-TSSOP (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
8Kb (1K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
5MHZ A-TMP 8-TSSOP
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock3,360 |
|
8-TSSOP (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
32Kb (4K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP |
||
Microchip Technology |
5MHZ A-TMP 8-SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,424 |
|
8-SOIC (0.154", 3.90mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
8Kb (1K x 8) |
SPI |
5MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |