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* Please refer to the English Version as our Official Version.
* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Memory Type |
Memory Format |
Technology |
Memory Size |
Memory Interface |
Clock Frequency |
Write Cycle Time - Word, Page |
Access Time |
Voltage - Supply |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Winbond Electronics |
SPIFLASH 512M-BIT 4KB UNIFORM
|
Package: 8-WDFN Exposed Pad |
Stock3,360 |
|
8-WDFN Exposed Pad |
SpiFlash® |
Non-Volatile |
FLASH |
FLASH - NOR |
512Mb (64M x 8) |
SPI - Quad I/O |
133MHz |
- |
- |
2.7V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-WDFN Exposed Pad |
8-WSON (8x6) |
|
|
|
Winbond Electronics |
SPIFLASH 512M-BIT 4KB UNIFORM
|
Package: 8-WDFN Exposed Pad |
Stock6,976 |
|
8-WDFN Exposed Pad |
SpiFlash® |
Non-Volatile |
FLASH |
FLASH - NOR |
512Mb (64M x 8) |
SPI - Quad I/O |
133MHz |
- |
- |
2.7V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-WDFN Exposed Pad |
8-WSON (8x6) |
|
|
|
Winbond Electronics |
SPIFLASH 512M-BIT 4KB UNIFORM
|
Package: 16-SOIC (0.295", 7.50mm Width) |
Stock7,376 |
|
16-SOIC (0.295", 7.50mm Width) |
SpiFlash® |
Non-Volatile |
FLASH |
FLASH - NOR |
512Mb (64M x 8) |
SPI - Quad I/O |
133MHz |
- |
- |
2.7V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
16-SOIC (0.295", 7.50mm Width) |
16-SOIC |
|
|
|
Winbond Electronics |
SPIFLASH 512M-BIT 4KB UNIFORM
|
Package: 16-SOIC (0.295", 7.50mm Width) |
Stock7,808 |
|
16-SOIC (0.295", 7.50mm Width) |
SpiFlash® |
Non-Volatile |
FLASH |
FLASH - NOR |
512Mb (64M x 8) |
SPI - Quad I/O |
133MHz |
- |
- |
2.7V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
16-SOIC (0.295", 7.50mm Width) |
16-SOIC |
|
|
|
Macronix |
SERIAL NOR
|
Package: 24-TBGA |
Stock7,696 |
|
24-TBGA |
MXSMIO™ |
Non-Volatile |
FLASH |
FLASH - NOR |
256Mb (32M x 8) |
SPI - Quad I/O, QPI, DTR |
133MHz |
30µs, 750µs |
- |
2.65V ~ 3.6V |
-40°C ~ 105°C (TA) |
Surface Mount |
24-TBGA |
24-BGA (6x8) |
|
|
|
Rohm Semiconductor |
MEMORY EEPROM
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock3,920 |
|
8-SOIC (0.154", 3.90mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
1Mb (128K x 8) |
I²C |
1MHz |
5ms |
- |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOP-J |
|
|
|
Rohm Semiconductor |
MEMORY EEPROM
|
Package: 8-SOIC (0.173", 4.40mm Width) |
Stock5,712 |
|
8-SOIC (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
1Mb (128K x 8) |
I²C |
1MHz |
5ms |
- |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.173", 4.40mm Width) |
8-SOP |
|
|
|
Microchip Technology |
16MBIT SPI/SQI FLASH 125C INDUST
|
Package: 8-WDFN Exposed Pad |
Stock3,408 |
|
8-WDFN Exposed Pad |
SST26 SQI® |
Non-Volatile |
FLASH |
FLASH |
16M (2M x 8) |
SPI - Quad I/O |
80MHz |
1.5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-WDFN Exposed Pad |
8-WDFN (5x6) |
|
|
|
Microchip Technology |
16MBIT SPI/SQI FLASH 125C INDUST
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,968 |
|
8-SOIC (0.154", 3.90mm Width) |
SST26 SQI® |
Non-Volatile |
FLASH |
FLASH |
16M (2M x 8) |
SPI - Quad I/O |
80MHz |
1.5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
|
|
|
Microchip Technology |
16MBIT SPI/SQI FLASH 125C INDUST
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock7,376 |
|
8-SOIC (0.154", 3.90mm Width) |
SST26 SQI® |
Non-Volatile |
FLASH |
FLASH |
16M (2M x 8) |
SPI - Quad I/O |
80MHz |
1.5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
|
|
|
Rohm Semiconductor |
MEMORY EEPROM
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,376 |
|
8-SOIC (0.154", 3.90mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
512Kb (64K x 8) |
I²C |
1MHz |
5ms |
- |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOP-J |
|
|
|
Rohm Semiconductor |
MEMORY EEPROM
|
Package: 8-SOIC (0.173", 4.40mm Width) |
Stock2,128 |
|
8-SOIC (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
512Kb (64K x 8) |
I²C |
1MHz |
5ms |
- |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-SOIC (0.173", 4.40mm Width) |
8-SOP |
|
|
|
Rohm Semiconductor |
MEMORY EEPROM
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock6,096 |
|
8-TSSOP (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
512Kb (64K x 8) |
I²C |
1MHz |
5ms |
- |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP-B |
|
|
|
Macronix |
SERIAL NOR
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock3,328 |
|
8-SOIC (0.154", 3.90mm Width) |
MXSMIO™ |
Non-Volatile |
FLASH |
FLASH - NOR |
32Mb (8M x 4) |
SPI - Quad I/O |
133MHz |
50µs, 1.2ms |
- |
2.65V ~ 3.6V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOP |
|
|
|
Rohm Semiconductor |
MEMORY EEPROM
|
Package: 8-SOIC (0.173", 4.40mm Width) |
Stock7,424 |
|
8-SOIC (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
128Kb (16K x 8) |
SPI |
10MHz |
4ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.173", 4.40mm Width) |
8-SOP |
|
|
|
Rohm Semiconductor |
IC EEPROM 16KB DIP8K
|
Package: 8-DIP (0.300", 7.62mm) |
Stock3,520 |
|
8-DIP (0.300", 7.62mm) |
- |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (2K x 8) |
I²C |
400kHz |
5ms |
- |
1.6V ~ 5.5V |
-40°C ~ 85°C (TA) |
Through Hole |
8-DIP (0.300", 7.62mm) |
8-DIPK |
|
|
|
Rohm Semiconductor |
MEMORY EEPROM
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock3,312 |
|
8-SOIC (0.154", 3.90mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
64Kb (8K x 8) |
SPI |
10MHz |
4ms |
- |
2.5V ~ 5.5V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOP-J |
|
|
|
Rohm Semiconductor |
MEMORY EEPROM
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock2,016 |
|
8-TSSOP (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
16Kb (1K x 16) |
SPI |
2MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 105°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP-B |
|
|
|
Rohm Semiconductor |
MEMORY EEPROM
|
Package: 8-TSSOP (0.173", 4.40mm Width) |
Stock3,056 |
|
8-TSSOP (0.173", 4.40mm Width) |
Automotive, AEC-Q100 |
Non-Volatile |
EEPROM |
EEPROM |
2Kb (128 x 16) |
SPI |
2MHz |
5ms |
- |
2.5V ~ 5.5V |
-40°C ~ 105°C (TA) |
Surface Mount |
8-TSSOP (0.173", 4.40mm Width) |
8-TSSOP-B |
|
|
|
Microchip Technology |
2.7-4.5V 125KBPS IND TMP 2-XSFN
|
Package: 2-SMD, No Lead |
Stock5,184 |
|
2-SMD, No Lead |
- |
Non-Volatile |
EEPROM |
EEPROM |
1Kb (128 x 8) |
I²C, Single Wire |
125kHz |
5ms |
- |
2.7V ~ 4.5V |
-40°C ~ 85°C (TC) |
Surface Mount |
2-SMD, No Lead |
2-XSFN (5x3.5) |
|
|
|
Microchip Technology |
2.3V TO 3.6V 4MBIT SPI FLASH 125
|
Package: 8-WDFN Exposed Pad |
Stock17,304 |
|
8-WDFN Exposed Pad |
Automotive, AEC-Q100, SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-WDFN Exposed Pad |
8-WDFN (5x6) |
|
|
|
Cypress Semiconductor Corp |
IC SRAM MICROPOWER 32SOIC
|
Package: - |
Stock5,088 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
|
|
|
Microchip Technology |
1.8V, 8MBIT SPI FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock17,088 |
|
8-SOIC (0.154", 3.90mm Width) |
SST25 |
Non-Volatile |
FLASH |
FLASH |
8Mb (1M x 8) |
SPI |
80MHz |
1ms |
- |
1.65V ~ 1.95V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
|
|
|
Microchip Technology |
4KB I2C EEPROM 1MHZ 1.7-5.5V 5-S
|
Package: SC-74A, SOT-753 |
Stock7,056 |
|
SC-74A, SOT-753 |
- |
Non-Volatile |
EEPROM |
EEPROM |
4Kb (256 x 8 x 2) |
I²C |
1MHz |
5ms |
450ns |
1.7V ~ 5.5V |
-40°C ~ 85°C (TA) |
Surface Mount |
SC-74A, SOT-753 |
SOT-23-5 |
|
|
|
Microchip Technology |
2.3V TO 3.6V 4MBIT SPI FLASH 125
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock19,716 |
|
8-SOIC (0.154", 3.90mm Width) |
Automotive, AEC-Q100, SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
5ms |
- |
2.3V ~ 3.6V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
|
|
|
ISSI, Integrated Silicon Solution Inc |
4G DDR4 256MX16 BGA(96)
|
Package: 96-BGA |
Stock7,116 |
|
96-BGA |
- |
Volatile |
DRAM |
SDRAM - DDR4 |
4Gb (256M x 16) |
Parallel |
1.2GHz |
15ns |
- |
1.14V ~ 1.26V |
-40°C ~ 95°C (TC) |
Surface Mount |
96-BGA |
96-BGA |
|
|
|
Microchip Technology |
1.8V, 4MBIT SPI FLASH
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock19,704 |
|
8-SOIC (0.154", 3.90mm Width) |
SST25 |
Non-Volatile |
FLASH |
FLASH |
4Mb (512K x 8) |
SPI |
40MHz |
1ms |
- |
1.65V ~ 1.95V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
|
|
|
ISSI, Integrated Silicon Solution Inc |
4G DDR4 256MX16 BGA(96)
|
Package: 96-BGA |
Stock5,376 |
|
96-BGA |
- |
Volatile |
DRAM |
SDRAM - DDR4 |
4Gb (256M x 16) |
Parallel |
1.2GHz |
15ns |
- |
1.14V ~ 1.26V |
0°C ~ 95°C (TC) |
Surface Mount |
96-BGA |
96-BGA |
|
|
|
Macronix |
S-NOR 1M
|
Package: 8-UFDFN Exposed Pad |
Stock6,132 |
|
8-UFDFN Exposed Pad |
MXSMIO™ |
Non-Volatile |
FLASH |
FLASH - NOR |
1Mb (128K x 8) |
SPI - Quad I/O |
104MHz |
100µs, 4ms |
- |
2.3V ~ 3.6V |
-40°C ~ 85°C (TA) |
Surface Mount |
8-UFDFN Exposed Pad |
8-USON (2x3) |
|
|
|
Alliance Memory, Inc. |
IC DRAM 2G 64MX32 LPDDR2 134BGA
|
Package: 134-VFBGA |
Stock6,688 |
|
134-VFBGA |
- |
Volatile |
DRAM |
SDRAM - Mobile LPDDR2 |
2Gb (64M x 32) |
Parallel |
400MHz |
15ns |
- |
1.14V ~ 1.95V |
-40°C ~ 85°C (TC) |
Surface Mount |
134-VFBGA |
134-FBGA (10x11.5) |
