* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Function |
Interface |
Number of Circuits |
Voltage - Supply |
Current - Supply |
Power (Watts) |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
ARROW 8XFE PB FREE
|
Package: - |
Stock3,920 |
|
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
8 CHANNEL FAST ETHERNET OVER SON
|
Package: - |
Stock3,104 |
|
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Broadcom Limited |
24FE + 2X2.5GE + 2X10G
|
Package: - |
Stock2,880 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
ARROW M8XFE
|
Package: - |
Stock6,576 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
IC CESOP PROCESSOR 552BGA
|
Package: 552-BGA |
Stock3,504 |
|
552-BGA |
- |
Telecom Circuit |
TDM |
1 |
1.65V ~ 1.95V |
950mA |
- |
-40°C ~ 85°C |
Surface Mount |
552-BGA |
552-PBGA (35x35) |
||
Broadcom Limited |
16GE + 10GE SWITCH
|
Package: - |
Stock4,368 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
8 CHANNEL 10/100 OR 1XGE ETHERNE
|
Package: - |
Stock5,968 |
|
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
TEMAP 84FDL GREEN DUAL PASSIVATI
|
Package: - |
Stock3,696 |
|
- |
- |
Framer |
E1, T1 |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8
|
Package: - |
Stock5,184 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
SINGLE-CHIP SONET/SDH TRANSPORT
|
Package: - |
Stock4,944 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
TELECOM INTERFACE ICS 32 LINK
|
Package: - |
Stock3,152 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
IC CESOP PROC 256CH 552BGA
|
Package: 552-BGA |
Stock5,520 |
|
552-BGA |
- |
Telecom Circuit |
TDM |
1 |
1.65V ~ 1.95V |
950mA |
- |
-40°C ~ 85°C |
Surface Mount |
552-BGA |
552-PBGA (35x35) |
||
Microchip Technology |
IC DGTL SWITCH F16KDX 272BGA
|
Package: 272-BGA |
Stock4,416 |
|
272-BGA |
- |
Switch |
- |
1 |
3V ~ 3.6V |
160mA |
- |
-40°C ~ 85°C |
Surface Mount |
272-BGA |
272-PBGA (27x27) |
||
Microchip Technology |
IC TXRX SGL E1 W/LIU 68PLCC
|
Package: 68-LCC (J-Lead) |
Stock3,104 |
|
68-LCC (J-Lead) |
- |
Transceiver |
- |
1 |
4.75V ~ 5.25V |
150mA |
- |
-40°C ~ 85°C |
Surface Mount |
68-LCC (J-Lead) |
68-PLCC |
||
Microchip Technology |
32 CHANNEL T1/E1 FRAMER
|
Package: - |
Stock6,816 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
IC SUBSCRIBER NETWRK DNIC 24SSOP
|
Package: - |
Stock3,104 |
|
- |
- |
Subscriber Line Interface Concept (SLIC) |
- |
1 |
4.75V ~ 5.25V |
10mA |
- |
-40°C ~ 85°C |
Surface Mount |
- |
24-SSOP |
||
Microchip Technology |
32 LINK, 256 HDLC CHANNEL FRAME
|
Package: - |
Stock3,904 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
COMBINED T1/E1 FRAMER/TRANSCEIVE
|
Package: 81-LFBGA |
Stock4,176 |
|
81-LFBGA |
- |
Transceiver |
E1, J1, T1 |
- |
3.3V |
- |
- |
-40°C ~ 85°C |
Surface Mount |
81-LFBGA |
81-CABGA (9x9) |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 324BGA
|
Package: 324-BGA |
Stock5,760 |
|
324-BGA |
- |
Telecom Circuit |
TDM |
1 |
1.65V ~ 1.95V |
950mA |
- |
-40°C ~ 85°C |
Surface Mount |
324-BGA |
324-PBGA (23x23) |
||
Microchip Technology |
IC TXRX SGL E1 W/LIU 100MQFP
|
Package: 100-BQFP |
Stock7,568 |
|
100-BQFP |
- |
Transceiver |
- |
1 |
4.75V ~ 5.25V |
150mA |
- |
-40°C ~ 85°C |
Surface Mount |
100-BQFP |
100-MQFP (14x20) |
||
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI
|
Package: - |
Stock5,040 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
IC TDM SWITCH 512CH 144LBGA
|
Package: 144-LBGA |
Stock3,472 |
|
144-LBGA |
- |
Switch |
- |
1 |
3V ~ 3.6V |
250mA |
- |
-40°C ~ 85°C |
Surface Mount |
144-LBGA |
144-LBGA (13x13) |
||
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI
|
Package: - |
Stock6,224 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
IC TDM/TSI SWITCH 512X256 44MQFP
|
Package: 44-QFP |
Stock3,312 |
|
44-QFP |
- |
Switch |
- |
1 |
4.75V ~ 5.25V |
10mA |
- |
-40°C ~ 85°C |
Surface Mount |
44-QFP |
44-MQFP (10x10) |
||
Microchip Technology |
IC CESOP PROCESSOR 128CH 552BGA
|
Package: 552-BGA |
Stock5,296 |
|
552-BGA |
- |
Telecom Circuit |
TDM |
1 |
1.65V ~ 1.95V |
950mA |
- |
-40°C ~ 85°C |
Surface Mount |
552-BGA |
552-PBGA (35x35) |
||
Microchip Technology |
IC TDM/TSI SWITCH 512X256 44PLCC
|
Package: 44-LCC (J-Lead) |
Stock5,552 |
|
44-LCC (J-Lead) |
- |
Switch |
- |
1 |
4.75V ~ 5.25V |
10mA |
- |
-40°C ~ 85°C |
Surface Mount |
44-LCC (J-Lead) |
44-PLCC (16.51x16.51) |
||
Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA
|
Package: 324-BGA |
Stock2,192 |
|
324-BGA |
- |
Telecom Circuit |
TDM |
1 |
1.65V ~ 1.95V |
950mA |
- |
-40°C ~ 85°C |
Surface Mount |
324-BGA |
324-PBGA (23x23) |
||
Microchip Technology |
IC TRANSCODER QUAD ADPCM 28DIP
|
Package: 28-DIP (0.600", 15.24mm) |
Stock4,896 |
|
28-DIP (0.600", 15.24mm) |
- |
Telecom Circuit |
- |
4 |
4.5V ~ 5.5V |
5mA |
- |
-40°C ~ 85°C |
Through Hole |
28-DIP (0.600", 15.24mm) |
28-PDIP |
||
Microchip Technology |
IC VOICE ECHO CANCELLER 208LBGA
|
Package: 208-LBGA |
Stock2,272 |
|
208-LBGA |
- |
Echo Cancellation |
- |
1 |
1.6V ~ 2V |
10mA |
- |
-40°C ~ 85°C |
Surface Mount |
208-LBGA |
208-LBGA (17x17) |
||
Microchip Technology |
IC TXRX SGL T1/E1/J1 3.3V 80LQFP
|
Package: 80-LQFP |
Stock6,944 |
|
80-LQFP |
- |
Transceiver |
- |
1 |
3V ~ 3.6V |
85mA |
- |
-40°C ~ 85°C |
Surface Mount |
80-LQFP |
80-LQFP (14x14) |