* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Number of I/O |
Interface |
Interrupt Output |
Features |
Output Type |
Current - Output Source/Sink |
Clock Frequency |
Voltage - Supply |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC I/O EXPANDER SPI 8B 18SOIC
|
Package: 18-SOIC (0.295", 7.50mm Width) |
Stock5,504 |
|
18-SOIC (0.295", 7.50mm Width) |
- |
8 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
18-SOIC (0.295", 7.50mm Width) |
18-SOIC |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 20SSOP
|
Package: 20-SSOP (0.209", 5.30mm Width) |
Stock14,916 |
|
20-SSOP (0.209", 5.30mm Width) |
- |
8 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
20-SSOP (0.209", 5.30mm Width) |
20-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 20QFN
|
Package: 20-VFQFN Exposed Pad |
Stock7,216 |
|
20-VFQFN Exposed Pad |
- |
8 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
20-VFQFN Exposed Pad |
20-QFN-EP (4x4) |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 18SOIC
|
Package: 18-SOIC (0.295", 7.50mm Width) |
Stock16,140 |
|
18-SOIC (0.295", 7.50mm Width) |
- |
8 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
18-SOIC (0.295", 7.50mm Width) |
18-SOIC |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 20SSOP
|
Package: 20-SSOP (0.209", 5.30mm Width) |
Stock17,976 |
|
20-SSOP (0.209", 5.30mm Width) |
- |
8 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
20-SSOP (0.209", 5.30mm Width) |
20-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 16QFN
|
Package: 16-VFQFN Exposed Pad |
Stock20,160 |
|
16-VFQFN Exposed Pad |
- |
8 |
SPI |
Yes |
- |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
16-VFQFN Exposed Pad |
16-QFN-EP (3x3) |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 18DIP
|
Package: 18-DIP (0.300", 7.62mm) |
Stock5,136 |
|
18-DIP (0.300", 7.62mm) |
- |
8 |
SPI |
Yes |
- |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Through Hole |
18-DIP (0.300", 7.62mm) |
18-PDIP |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 18SOIC
|
Package: 18-SOIC (0.295", 7.50mm Width) |
Stock8,004 |
|
18-SOIC (0.295", 7.50mm Width) |
- |
8 |
SPI |
Yes |
- |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
18-SOIC (0.295", 7.50mm Width) |
18-SOIC |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 16QFN
|
Package: 16-VFQFN Exposed Pad |
Stock4,272 |
|
16-VFQFN Exposed Pad |
- |
8 |
SPI |
Yes |
- |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
16-VFQFN Exposed Pad |
16-QFN-EP (3x3) |
||
Microchip Technology |
IC I/O EXPANDER SPI 8B 18SOIC
|
Package: 18-SOIC (0.295", 7.50mm Width) |
Stock3,008 |
|
18-SOIC (0.295", 7.50mm Width) |
- |
8 |
SPI |
Yes |
- |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
18-SOIC (0.295", 7.50mm Width) |
18-SOIC |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28QFN
|
Package: 28-VQFN Exposed Pad |
Stock6,176 |
|
28-VQFN Exposed Pad |
- |
16 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
28-VQFN Exposed Pad |
28-QFN (6x6) |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock44,616 |
|
28-SOIC (0.295", 7.50mm Width) |
- |
16 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
28-SOIC (0.295", 7.50mm Width) |
28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SDIP
|
Package: 28-DIP (0.300", 7.62mm) |
Stock6,416 |
|
28-DIP (0.300", 7.62mm) |
- |
16 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Through Hole |
28-DIP (0.300", 7.62mm) |
28-SPDIP |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SSOP
|
Package: 28-SSOP (0.209", 5.30mm Width) |
Stock8,712 |
|
28-SSOP (0.209", 5.30mm Width) |
- |
16 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
28-SSOP (0.209", 5.30mm Width) |
28-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28QFN
|
Package: 28-VQFN Exposed Pad |
Stock2,896 |
|
28-VQFN Exposed Pad |
- |
16 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
28-VQFN Exposed Pad |
28-QFN (6x6) |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock19,200 |
|
28-SOIC (0.295", 7.50mm Width) |
- |
16 |
SPI |
Yes |
POR |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
28-SOIC (0.295", 7.50mm Width) |
28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SSOP
|
Package: 28-SSOP (0.209", 5.30mm Width) |
Stock173,580 |
|
28-SSOP (0.209", 5.30mm Width) |
- |
16 |
SPI |
Yes |
- |
Push-Pull |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
28-SSOP (0.209", 5.30mm Width) |
28-SSOP |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 24QFN
|
Package: 24-VFQFN Exposed Pad |
Stock6,608 |
|
24-VFQFN Exposed Pad |
- |
16 |
SPI |
Yes |
- |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
24-VFQFN Exposed Pad |
24-QFN (4x4) |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock14,052 |
|
28-SOIC (0.295", 7.50mm Width) |
- |
16 |
SPI |
Yes |
- |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
28-SOIC (0.295", 7.50mm Width) |
28-SOIC |
||
Microchip Technology |
IC EXPANDER SPI 16BIT I/O 28SDIP
|
Package: 28-DIP (0.300", 7.62mm) |
Stock15,588 |
|
28-DIP (0.300", 7.62mm) |
- |
16 |
SPI |
Yes |
- |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Through Hole |
28-DIP (0.300", 7.62mm) |
28-SPDIP |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 24QFN
|
Package: 24-VFQFN Exposed Pad |
Stock4,896 |
|
24-VFQFN Exposed Pad |
- |
16 |
SPI |
Yes |
- |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
24-VFQFN Exposed Pad |
24-QFN (4x4) |
||
Microchip Technology |
EXPANDERS
|
Package: 24-VFQFN Exposed Pad |
Stock6,496 |
|
24-VFQFN Exposed Pad |
Automotive, AEC-Q100 |
16 |
SPI |
Yes |
POR |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
24-VFQFN Exposed Pad |
24-QFN (4x4) |
||
Microchip Technology |
IC I/O EXPANDER SPI 16B 28SOIC
|
Package: 28-SOIC (0.295", 7.50mm Width) |
Stock7,184 |
|
28-SOIC (0.295", 7.50mm Width) |
- |
16 |
SPI |
Yes |
- |
Open Drain |
25mA |
10MHz |
1.8 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
28-SOIC (0.295", 7.50mm Width) |
28-SOIC |
||
Microchip Technology |
IC I/O EXPANDER CAN 8B 14DIP
|
Package: 14-DIP (0.300", 7.62mm) |
Stock7,504 |
|
14-DIP (0.300", 7.62mm) |
- |
8 |
CAN V2.0b |
No |
ADC, EEPROM, PWM |
Push-Pull |
25mA |
25MHz |
4.5 V ~ 5.5 V |
-40°C ~ 125°C |
Through Hole |
14-DIP (0.300", 7.62mm) |
14-PDIP |
||
Microchip Technology |
IC I/O EXPANDER CAN 8B 14SOIC
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock4,864 |
|
14-SOIC (0.154", 3.90mm Width) |
- |
8 |
CAN V2.0b |
No |
ADC, EEPROM, PWM |
Push-Pull |
25mA |
25MHz |
4.5 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
14-SOIC (0.154", 3.90mm Width) |
14-SOIC |
||
Microchip Technology |
IC I/O EXPANDER CAN 8B 14DIP
|
Package: 14-DIP (0.300", 7.62mm) |
Stock5,344 |
|
14-DIP (0.300", 7.62mm) |
- |
8 |
CAN V2.0b |
No |
ADC, EEPROM, PWM |
Push-Pull |
25mA |
4MHz |
2.75 V ~ 5.5 V |
-40°C ~ 85°C |
Through Hole |
14-DIP (0.300", 7.62mm) |
14-PDIP |
||
Microchip Technology |
IC I/O EXPANDER CAN 8B 14SOIC
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock11,784 |
|
14-SOIC (0.154", 3.90mm Width) |
- |
8 |
CAN V2.0b |
No |
ADC, EEPROM, PWM |
Push-Pull |
25mA |
4MHz |
2.75 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
14-SOIC (0.154", 3.90mm Width) |
14-SOIC |
||
Microchip Technology |
IC I/O EXPANDER CAN 8B 14SOIC
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock4,880 |
|
14-SOIC (0.154", 3.90mm Width) |
- |
8 |
CAN V2.0b |
No |
ADC, EEPROM, PWM |
Push-Pull |
25mA |
25MHz |
4.5 V ~ 5.5 V |
-40°C ~ 125°C |
Surface Mount |
14-SOIC (0.154", 3.90mm Width) |
14-SOIC |
||
Microchip Technology |
IC I/O EXPANDER CAN 8B 14SOIC
|
Package: 14-SOIC (0.154", 3.90mm Width) |
Stock7,360 |
|
14-SOIC (0.154", 3.90mm Width) |
- |
8 |
CAN V2.0b |
No |
ADC, EEPROM, PWM |
Push-Pull |
25mA |
4MHz |
2.7 V ~ 5.5 V |
-40°C ~ 85°C |
Surface Mount |
14-SOIC (0.154", 3.90mm Width) |
14-SOIC |
||
Microchip Technology |
IC I/O EXPANDER CAN 8B 14DIP
|
Package: 14-DIP (0.300", 7.62mm) |
Stock6,320 |
|
14-DIP (0.300", 7.62mm) |
- |
8 |
CAN (1-Wire) |
No |
ADC, EEPROM, PWM |
Push-Pull |
25mA |
4MHz |
2.7 V ~ 5.5 V |
-40°C ~ 85°C |
Through Hole |
14-DIP (0.300", 7.62mm) |
14-PDIP |