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Sockets for ICs, Transistors

Records 11083
Page  333/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
Preci-Dip
CONN IC DIP SOCKET 4POS GOLD
Package: -
Stock4,968
-
114
DIP, 0.3" (7.62mm) Row Spacing
4 (2 x 2)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 4POS GOLD
Package: -
Stock3,438
-
116
DIP, 0.3" (7.62mm) Row Spacing
4 (2 x 2)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock7,290
-
110
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock6,048
-
110
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
CNC Tech
CONN IC DIP SOCKET 32POS TIN
Package: -
Stock4,572
-
-
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
CNC Tech
CONN IC DIP SOCKET 22POS TIN
Package: -
Stock2,178
-
-
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 6POS TIN
Package: -
Stock6,390
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 105°C
Preci-Dip
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock3,276
-
115
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 4POS GOLD
Package: -
Stock5,094
-
115
DIP, 0.3" (7.62mm) Row Spacing
4 (2 x 2)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Harwin Inc.
CONN SOCKET SIP 5POS GOLD
Package: -
Stock3,906
-
D01-997
SIP
5 (1 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Aries Electronics
CONN SOCKET SIP 1POS GOLD
Package: -
Stock2,556
-
518
SIP
1 (1 x 1)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN SOCKET SIP 1POS GOLD
Package: -
Stock7,128
-
518
SIP
1 (1 x 1)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN SOCKET SIP 1POS GOLD
Package: -
Stock2,646
-
0513
SIP
1 (1 x 1)
-
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
-
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Aries Electronics
CONN SOCKET SIP 1POS GOLD
Package: -
Stock7,074
-
0513
SIP
1 (1 x 1)
-
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
-
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Omron Electronics Inc-EMC Div
CONN IC SOCKET 32POS
Package: -
Stock8,082
-
XR2
Housing
32 (1 x 32)
0.100" (2.54mm)
-
-
Beryllium Copper
Through Hole
Closed Frame
Wire Wrap
0.100" (2.54mm)
-
-
Beryllium Copper
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 4POS GOLD
Package: -
Stock3,436
-
116
DIP, 0.3" (7.62mm) Row Spacing
4 (2 x 2)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
CNC Tech
CONN IC DIP SOCKET 20POS TIN
Package: -
Stock4,302
-
-
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole, Kinked Pin
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
Amphenol FCI
CONN IC DIP SOCKET
Package: -
Stock2,592
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Preci-Dip
CONN IC DIP SOCKET 4POS GOLD
Package: -
Stock5,634
-
612
DIP, 0.3" (7.62mm) Row Spacing
4 (2 x 2)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Preci-Dip
CONN IC DIP SOCKET 321POS GOLD
Package: -
Stock2,052
-
614
DIP, 0.3" (7.62mm) Row Spacing
321 (21 x 21)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
Assmann WSW Components
SOCKET 3 CONTACTS SINGLE ROW
Package: -
Stock2,718
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CNC Tech
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock8,064
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
Harwin Inc.
CONN SOCKET SIP 4POS GOLD
Package: -
Stock7,578
-
D01-997
SIP
4 (1 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Amphenol FCI
CONN IC DIP SOCKET
Package: -
Stock7,272
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
On Shore Technology Inc.
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock2,538
-
WMS
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame, Wash Away
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
-
-40°C ~ 105°C
Amphenol FCI
CONN IC DIP SOCKET
Package: -
Stock4,032
-
*
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CNC Tech
CONN IC DIP SOCKET 24POS TIN
Package: -
Stock7,236
-
-
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100µin (2.54µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
Harwin Inc.
CONN SOCKET SIP 3POS GOLD
Package: -
Stock8,190
-
D01-997
SIP
3 (1 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
196.8µin (5.00µm)
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
-55°C ~ 125°C
Assmann WSW Components
SOCKET 2 CONTACTS SINGLE ROW
Package: -
Stock4,122
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Preci-Dip
CONN IC DIP SOCKET 4POS GOLD
Package: -
Stock6,426
-
114
DIP, 0.3" (7.62mm) Row Spacing
4 (2 x 2)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C