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Sockets for ICs, Transistors

Records 11083
Page  23/370
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Package
Series
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock6,984
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock8,748
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock5,472
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock4,932
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 8POS GOLD
Package: -
Stock7,758
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 40POS GOLD
Package: -
Stock4,392
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock6,876
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS GOLD
Package: -
Stock3,168
-
Diplomate DL
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 24POS GOLD
Package: -
Stock7,308
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock2,952
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 20POS GOLD
Package: -
Stock3,888
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 18POS GOLD
Package: -
Stock4,302
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 16POS GOLD
Package: -
Stock2,016
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 14POS GOLD
Package: -
Stock3,600
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock4,482
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
15µin (0.38µm)
Phosphor Bronze
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock7,002
-
Diplomate DL
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Thermoplastic, Glass Filled
-55°C ~ 125°C
TE Connectivity AMP Connectors
CONN SOCKET PLCC 44POS TIN
Package: -
Stock4,374
-
-
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Thermoplastic
-
TE Connectivity AMP Connectors
CONN IC DIP SOCKET 28POS TIN
Package: -
Stock8,892
-
-
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
-
-40°C ~ 105°C
Assmann WSW Components
CONN IC DIP SOCKET 22POS GOLD
Package: -
Stock6,786
-
-
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 84POS TIN
Package: -
Stock4,572
-
540
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 68POS TIN
Package: -
Stock7,488
-
540
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 52POS TIN
Package: -
Stock3,564
-
540
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 44POS TIN
Package: -
Stock6,678
-
540
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 32POS TIN
Package: -
Stock7,776
-
540
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Polyphenylene Sulfide (PPS)
-
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 28POS TIN
Package: -
Stock8,568
-
540
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Polyphenylene Sulfide (PPS)
-
Assmann WSW Components
CONN IC DIP SOCKET 6POS GOLD
Package: -
Stock3,384
-
-
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
-
-
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
-
-
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 68POS TIN
Package: -
Stock6,210
-
-
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 52POS TIN
Package: -
Stock7,362
-
-
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 44POS TIN
Package: -
Stock4,500
-
-
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
Assmann WSW Components
CONN SOCKET PLCC 32POS TIN
Package: -
Stock7,596
-
-
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C