* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Applications |
Core Processor |
Program Memory Type |
Controller Series |
RAM Size |
Interface |
Number of I/O |
Voltage - Supply |
Operating Temperature |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
SRAM
|
Package: 128-TQFP |
Stock15,564 |
|
128-TQFP |
- |
Keyboard and Embedded Controller |
MIPS32® M14K™ |
External Program Memory |
- |
192KB |
I²C, LPC, SMBus, SPI, UART |
108 |
1.71 V ~ 3.465 V |
-40°C ~ 85°C |
Surface Mount |
128-TQFP |
128-TQFP (14x14) |
||
Microchip Technology |
SRAM
|
Package: 128-TQFP Exposed Pad |
Stock6,304 |
|
128-TQFP Exposed Pad |
- |
Keyboard and Embedded Controller |
MIPS32® M14K™ |
External Program Memory |
- |
192KB |
I²C, LPC, SMBus, SPI, UART |
108 |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
Surface Mount |
128-TQFP Exposed Pad |
128-TQFP (14x14) |
||
Microchip Technology |
SRAM
|
Package: 144-WFBGA |
Stock9,144 |
|
144-WFBGA |
- |
Keyboard and Embedded Controller |
MIPS32® M14K™ |
External Program Memory |
- |
192KB |
I²C, LPC, SMBus, SPI, UART |
108 |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
Surface Mount |
144-WFBGA |
144-WFBGA (9x9) |
||
Microchip Technology |
SRAM
|
Package: 144-WFBGA |
Stock4,688 |
|
144-WFBGA |
- |
Keyboard and Embedded Controller |
MIPS32® M14K™ |
External Program Memory |
- |
192KB |
I²C, LPC, SMBus, SPI, UART |
108 |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
Surface Mount |
144-WFBGA |
144-WFBGA (9x9) |
||
Microchip Technology |
SRAM
|
Package: 128-WFBGA |
Stock17,640 |
|
128-WFBGA |
- |
Keyboard and Embedded Controller |
MIPS32® M14K™ |
External Program Memory |
- |
192KB |
I²C, LPC, SMBus, SPI, UART |
108 |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
Surface Mount |
128-WFBGA |
128-WFBGA (7x7) |
||
Microchip Technology |
SRAM
|
Package: 128-WFBGA |
Stock3,872 |
|
128-WFBGA |
- |
Keyboard and Embedded Controller |
MIPS32® M14K™ |
External Program Memory |
- |
192KB |
I²C, LPC, SMBus, SPI, UART |
108 |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
Surface Mount |
128-WFBGA |
128-WFBGA (7x7) |
||
Microchip Technology |
IC EMBEDDED CTLR
|
Package: 144-LFBGA |
Stock43,548 |
|
144-LFBGA |
- |
I/O Controller |
ARC-625D |
FLASH (192 kB) |
- |
16KB |
ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC |
115 |
3.3V |
0°C ~ 70°C |
Surface Mount |
144-LFBGA |
144-LFBGA (10x10) |
||
Microchip Technology |
IC EMBEDDED CTLR 144TFBGA
|
Package: 144-TFBGA |
Stock2,960 |
|
144-TFBGA |
- |
I/O Controller |
ARC-625D |
FLASH (192 kB) |
- |
16KB |
ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC |
115 |
3.3V |
0°C ~ 70°C |
Surface Mount |
144-TFBGA |
144-TFBGA (7x7) |
||
Microchip Technology |
MIXED SIGNAL MOBILE EMBEDDED CON
|
Package: 144-LFBGA |
Stock3,392 |
|
144-LFBGA |
- |
I/O Controller |
ARC-625D |
FLASH (192 kB) |
- |
16KB |
ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI, VLPC |
115 |
3.3V |
-40°C ~ 85°C |
Surface Mount |
144-LFBGA |
144-LFBGA (10x10) |
||
Microchip Technology |
IC EMBEDDED CTLR
|
Package: - |
Stock3,472 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
IC EMBEDDED CTLR 169LFBGA
|
Package: 169-LFBGA |
Stock6,128 |
|
169-LFBGA |
- |
I/O Controller |
ARC-625D |
FLASH (192 kB) |
- |
16KB |
ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI |
135 |
3.3V |
0°C ~ 85°C |
Surface Mount |
169-LFBGA |
169-LFBGA (11x11) |
||
Microchip Technology |
EMBEDDED CONTROLLER 256KB TOTAL
|
Package: - |
Stock16,128 |
|
- |
- |
Keyboard and Embedded Controller |
ARM? Cortex?-M4 |
External Program Memory |
- |
256KB |
ACPI, EBI/EMI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI |
123 |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
Surface Mount |
- |
144-WFBGA (9x9) |
||
Microchip Technology |
EMBEDDED CONTROLLER 256KB TOTAL
|
Package: - |
Stock27,468 |
|
- |
- |
Keyboard and Embedded Controller |
ARM? Cortex?-M4 |
External Program Memory |
- |
256KB |
ACPI, EBI/EMI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI |
123 |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
Surface Mount |
- |
144-WFBGA (9x9) |
||
Microchip Technology |
EMBEDDED CONTROLLER
|
Package: 144-WFBGA |
Stock12,324 |
|
144-WFBGA |
- |
Keyboard and Embedded Controller |
ARM® Cortex®-M4 |
Boot ROM (64 kB) |
MEC170x |
480KB |
ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI |
123 |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
Surface Mount |
144-WFBGA |
144-WFBGA (9x9) |
||
Microchip Technology |
SRAM
|
Package: 169-WFBGA |
Stock16,080 |
|
169-WFBGA |
- |
Keyboard and Embedded Controller |
ARM® Cortex®-M4 |
Boot ROM (64 kB) |
MEC170x |
480KB |
ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI |
148 |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
Surface Mount |
169-WFBGA |
169-WFBGA (11x11) |
||
Microchip Technology |
EMBEDDED CONTROLLER 480 KB TOTAL
|
Package: 169-WFBGA |
Stock7,656 |
|
169-WFBGA |
- |
Keyboard and Embedded Controller |
ARM® Cortex®-M4 |
- |
MEC170x |
480KB |
ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI |
148 |
1.71V ~ 1.89V, 3.135V ~ 3.465V |
0°C ~ 70°C |
Surface Mount |
169-WFBGA |
169-WFBGA (11x11) |
||
Microchip Technology |
SRAM
|
Package: 169-WFBGA |
Stock17,172 |
|
169-WFBGA |
- |
Keyboard and Embedded Controller |
ARM® Cortex®-M4 |
EEPROM (2 kB), Boot ROM (64 kB) |
MEC170x |
480KB |
ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI |
- |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
Surface Mount |
169-WFBGA |
169-WFBGA (8x8) |
||
Microchip Technology |
EMBEDDED CONTROLLER 480 KB TOTAL
|
Package: - |
Stock4,448 |
|
- |
* |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
||
Microchip Technology |
EMBEDDED CONTROLLER 480 KB TOTAL
|
Package: 144-WFBGA |
Stock13,392 |
|
144-WFBGA |
- |
Keyboard and Embedded Controller |
ARM® Cortex®-M4 |
Boot ROM (64 kB) |
MEC170x |
480KB |
ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI |
123 |
1.71 V ~ 3.465 V |
-40°C ~ 85°C |
Surface Mount |
144-WFBGA |
144-WFBGA (9x9) |
||
Microchip Technology |
EMBEDDED CONTROLLER 480 KB TOTAL
|
Package: - |
Stock7,888 |
|
- |
- |
Keyboard and Embedded Controller |
ARM? Cortex?-M4 |
EEPROM (2 kB) |
- |
480KB |
ACPI, EBI/EMI, eSPI, I2C, LPC, PECI, PS/2, QSPI, SPI |
123 |
1.71 V ~ 3.465 V |
0°C ~ 70°C |
- |
- |
- |
||
Microchip Technology |
EMBEDDED CONTROLLER
|
Package: 144-WFBGA |
Stock16,680 |
|
144-WFBGA |
- |
Keyboard and Embedded Controller |
ARM® Cortex®-M4 |
EEPROM (2 kB), Boot ROM (64 kB) |
MEC170x |
480KB |
ACPI, EBI/EMI, eSPI, I²C, LPC, PECI, PS/2, QSPI, SPI |
123 |
1.71 V ~ 3.465 V |
-40°C ~ 85°C |
Surface Mount |
144-WFBGA |
144-WFBGA (9x9) |
||
Rohm Semiconductor |
IC MCU 32BIT 128KB FLSH 144LFBGA
|
Package: 144-LFBGA |
Stock3,536 |
|
144-LFBGA |
- |
Fingerprint Authentication |
ARM7TDMI |
FLASH (128 kB) |
- |
16K x 8 |
EBI/EMI, SmartCard, SPI, SSIO, UART/USART, USB |
3 |
2.25 V ~ 3.6 V |
-40°C ~ 85°C |
Surface Mount |
144-LFBGA |
144-LFBGA (10x10) |
||
Melexis Technologies NV |
IC LIN RGB 32KB 16KROM 4IO 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock5,568 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
LIN Controller |
16-Bit RISC |
FLASH (32 kB), ROM (16 kB) |
- |
2K x 8 |
SPI |
4 |
5.5 V ~ 18 V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Melexis Technologies NV |
IC LIN RGB 32KB 16KROM 4IO 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock6,096 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
LIN Controller |
16-Bit RISC |
FLASH (32 kB), ROM (16 kB) |
- |
2K x 8 |
SPI |
4 |
5.5 V ~ 18 V |
-40°C ~ 125°C (TA) |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Melexis Technologies NV |
IC DUAL LIN RGB 32K16K 6IO 12DFN
|
Package: 12-VFDFN Exposed Pad |
Stock6,320 |
|
12-VFDFN Exposed Pad |
- |
LIN Controller |
16-Bit RISC |
FLASH (32 kB), ROM (16 kB) |
- |
2K x 8 |
SPI |
6 |
5.5 V ~ 18 V |
-40°C ~ 125°C (TA) |
Surface Mount |
12-VFDFN Exposed Pad |
12-DFN (4x4) |
||
Melexis Technologies NV |
IC DUAL LIN RGB 32K16K 6IO 12DFN
|
Package: 12-VFDFN Exposed Pad |
Stock2,400 |
|
12-VFDFN Exposed Pad |
- |
LIN Controller |
16-Bit RISC |
FLASH (32 kB), ROM (16 kB) |
- |
2K x 8 |
SPI |
6 |
5.5 V ~ 18 V |
-40°C ~ 125°C (TA) |
Surface Mount |
12-VFDFN Exposed Pad |
12-DFN (4x4) |
||
Melexis Technologies NV |
IC LIN-TO-LIN GW CTRLR 12DFN
|
Package: 12-VFDFN Exposed Pad |
Stock5,712 |
|
12-VFDFN Exposed Pad |
- |
LIN Controller |
16-Bit RISC |
FLASH (32 kB), ROM (16 kB) |
- |
2K x 8 |
UART |
4 |
5.5 V ~ 18 V |
-40°C ~ 125°C (TA) |
Surface Mount |
12-VFDFN Exposed Pad |
12-DFN (4x4) |
||
Melexis Technologies NV |
IC LIN-TO-LIN GW CTRLR 12DFN
|
Package: 12-VFDFN Exposed Pad |
Stock5,104 |
|
12-VFDFN Exposed Pad |
- |
LIN Controller |
16-Bit RISC |
FLASH (32 kB), ROM (16 kB) |
- |
2K x 8 |
UART |
4 |
5.5 V ~ 18 V |
-40°C ~ 125°C (TA) |
Surface Mount |
12-VFDFN Exposed Pad |
12-DFN (4x4) |
||
NXP |
IC QUAD HALF BRDG TRPL SW 54SOIC
|
Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock4,128 |
|
54-BSSOP (0.295", 7.50mm Width) Exposed Pad |
- |
Automotive Mirror Control |
HC08 |
FLASH (16 kB) |
908E |
512 x 8 |
SCI, SPI |
12 |
9 V ~ 16 V |
-40°C ~ 85°C |
Surface Mount |
54-BSSOP (0.295", 7.50mm Width) Exposed Pad |
54-SOICW-EP |
||
NXP |
IC SW QUAD HB/TRPL HISID 54-SOIC
|
Package: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad |
Stock6,224 |
|
54-BSSOP (0.295", 7.50mm Width) Exposed Pad |
- |
Automotive Mirror Control |
HC08 |
FLASH (16 kB) |
908E |
512 x 8 |
SCI, SPI |
12 |
9 V ~ 16 V |
-40°C ~ 85°C |
Surface Mount |
54-BSSOP (0.295", 7.50mm Width) Exposed Pad |
54-SOICW-EP |