* Please refer to the English Version as our Official Version.
Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Package |
Series |
Type |
Applications |
Mounting Type |
Package / Case |
Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
IC TRANSPORT TDM DUAL 256-CSBGA
|
Package: 256-BGA, CSBGA |
Stock3,408 |
|
256-BGA, CSBGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
256-BGA, CSBGA |
256-CSBGA (17x17) |
||
Maxim Integrated |
IC TRANSPORT TDM/PACKET 256CSBGA
|
Package: 256-BGA, CSBGA |
Stock7,232 |
|
256-BGA, CSBGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
256-BGA, CSBGA |
256-CSBGA (17x17) |
||
Maxim Integrated |
IC TRANSPORT TDM 256CSBGA
|
Package: 256-BGA, CSBGA |
Stock5,824 |
|
256-BGA, CSBGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
256-BGA, CSBGA |
256-CSBGA (17x17) |
||
Maxim Integrated |
IC TDM/PACKET TRANSPORT
|
Package: 484-BGA |
Stock14,100 |
|
484-BGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
484-BGA |
484-TEBGA (23x23) |
||
Maxim Integrated |
IC TRANSPORT TDM 484BGA
|
Package: 484-BGA |
Stock5,456 |
|
484-BGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
484-BGA |
484-TEBGA (23x23) |
||
Maxim Integrated |
IC TDM/PACKET CHIP 484-BGA
|
Package: 484-BGA |
Stock7,216 |
|
484-BGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
484-BGA |
484-TEBGA (23x23) |
||
Maxim Integrated |
IC TDM OVER PACKET 484BGA
|
Package: 484-BGA |
Stock6,400 |
|
484-BGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
484-BGA |
484-TEBGA (23x23) |
||
Maxim Integrated |
IC TDM/PACKET CHIP 484-BGA
|
Package: 484-BGA |
Stock3,584 |
|
484-BGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
484-BGA |
484-TEBGA (23x23) |
||
Maxim Integrated |
IC TDM OVER PACKET 484BGA
|
Package: 484-BGA |
Stock7,776 |
|
484-BGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
484-BGA |
484-TEBGA (23x23) |
||
Maxim Integrated |
IC TDM/PACKET CHIP 484-BGA
|
Package: 484-BGA |
Stock8,076 |
|
484-BGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
484-BGA |
484-TEBGA (23x23) |
||
Maxim Integrated |
IC TDM OVER PACKET 484BGA
|
Package: 484-BGA |
Stock12,708 |
|
484-BGA |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
484-BGA |
484-TEBGA (23x23) |
||
Maxim Integrated |
IC TDM/PACKET CHIP 484-BGA
|
Package: 484-BGA Exposed Pad |
Stock4,928 |
|
484-BGA Exposed Pad |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
484-BGA Exposed Pad |
484-HSBGA (23x23) |
||
Maxim Integrated |
IC TDM OVER PACKET 484HSBGA
|
Package: 484-BGA Exposed Pad |
Stock25,296 |
|
484-BGA Exposed Pad |
- |
TDM (Time Division Multiplexing) |
Data Transport |
Surface Mount |
484-BGA Exposed Pad |
484-HSBGA (23x23) |
||
Maxim Integrated |
IC CTRLR NV SRAM 3.6V 25-CSBGA
|
Package: 25-TFBGA, CSPBGA |
Stock2,816 |
|
25-TFBGA, CSPBGA |
DeepCover? |
Security Controller |
- |
Surface Mount |
25-TFBGA, CSPBGA |
25-CSBGA (5x5) |
||
Maxim Integrated |
IC MODULATOR/DECODER 16-TSSOP
|
Package: 16-TSSOP (0.173", 4.40mm Width) |
Stock3,312 |
|
16-TSSOP (0.173", 4.40mm Width) |
- |
Modulator |
Energy Measurement |
Surface Mount |
16-TSSOP (0.173", 4.40mm Width) |
16-TSSOP |
||
Maxim Integrated |
CONTACT TOUCH AND HOLD
|
Package: - |
Stock17,052 |
|
- |
- |
Holder |
Data Transport |
- |
- |
- |
||
Maxim Integrated |
CONTACT TOUCH AND HOLD
|
Package: - |
Stock7,200 |
|
- |
- |
Holder |
Data Transport |
- |
- |
- |
||
Maxim Integrated |
IC INTERFACE MISC
|
Package: - |
Stock5,456 |
|
- |
- |
- |
- |
- |
- |
- |
||
Panasonic Industrial Automation Sales |
RTEX CHIP
|
Package: - |
Stock3,184 |
|
- |
* |
- |
- |
- |
- |
- |
||
Maxim Integrated |
IC INTERFACE MISC
|
Package: - |
Stock4,720 |
|
- |
- |
- |
- |
- |
- |
- |
||
IDT, Integrated Device Technology Inc |
IC SWITCH RIO
|
Package: - |
Stock4,208 |
|
- |
* |
- |
- |
- |
- |
- |
||
Fairchild/ON Semiconductor |
IC CTRLR AC GRND FAULT 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock2,880 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Controller |
Ground Fault Protection |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
ON Semiconductor |
IC CONTROLLER 8SOIC
|
Package: 8-SOIC (0.154", 3.90mm Width) |
Stock253,308 |
|
8-SOIC (0.154", 3.90mm Width) |
- |
Controller |
Ground Fault Protection |
Surface Mount |
8-SOIC (0.154", 3.90mm Width) |
8-SOIC |
||
Fairchild/ON Semiconductor |
IC CTRLR AC GRND FAULT 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock5,424 |
|
8-DIP (0.300", 7.62mm) |
- |
Controller |
Ground Fault Protection |
Through Hole |
8-DIP (0.300", 7.62mm) |
8-DIP |
||
ON Semiconductor |
IC CONTROLLER 8DIP
|
Package: 8-DIP (0.300", 7.62mm) |
Stock199,500 |
|
8-DIP (0.300", 7.62mm) |
- |
Controller |
Ground Fault Protection |
Through Hole |
8-DIP (0.300", 7.62mm) |
8-DIP |
||
Fairchild/ON Semiconductor |
IC LANDING CORRECTION 10SIPH
|
Package: 10-SIP, 10-SIPH |
Stock2,944 |
|
10-SIP, 10-SIPH |
* |
- |
- |
Surface Mount |
10-SIP, 10-SIPH |
10-SIPH |
||
ON Semiconductor |
IC LANDING CORRECTION 10SIPHD
|
Package: 10-SIP |
Stock3,520 |
|
10-SIP |
* |
Landing Correction (Amplifier) |
- |
Through Hole |
10-SIP |
10-SIPHD |
||
ON Semiconductor |
IC IGNITION COIL DRIVER D2PAK
|
Package: TO-263-7, D²Pak (6 Leads + Tab) |
Stock3,008 |
|
TO-263-7, D²Pak (6 Leads + Tab) |
- |
Ignition Coil Driver |
Automotive |
Surface Mount |
TO-263-7, D²Pak (6 Leads + Tab) |
TO-263-7 |
||
Fairchild/ON Semiconductor |
SMART IGBT
|
Package: - |
Stock4,432 |
|
- |
* |
- |
- |
- |
- |
- |
||
STMicroelectronics |
IC FIRE LIGHTER CIRCUIT D-PAK
|
Package: TO-252-3, DPak (2 Leads + Tab), SC-63 |
Stock7,872 |
|
TO-252-3, DPak (2 Leads + Tab), SC-63 |
- |
- |
- |
Surface Mount |
TO-252-3, DPak (2 Leads + Tab), SC-63 |
DPAK |