Beijing, China, April 9, 2024- X-FAB Silicon Foundries ("X-FAB"), a globally recognized excellent analog/mixed signal wafer foundry, announced today that it has added new members to its optical sensor product platform - to meet the performance requirements of the new generation of image sensors, X-FAB has now opened up backlighting (BSI) functionality on its popular CMOS sensor process platform XS018 (180 nanometers).

Through the BSI process, the performance of imaging photosensitive pixels will be greatly enhanced. This technology ensures that the incident light received by each pixel is no longer obstructed by the metal layer of the backend process, greatly improving the fill ratio of the sensor, up to 100%. Due to its ability to achieve higher pixel sensitivity, this advantage is particularly significant under low light conditions. Meanwhile, due to the shortened optical path, the BSI process can effectively reduce crosstalk between adjacent pixels, thereby improving the imaging quality of the image. Although BSI technology has been widely applied to 300mm wafers and is widely used in consumer grade small pixel image sensors, it is mainly used in the industrial, medical, and automotive fields for the 200mm wafer market; Alternatively, for scenes that require additional customization and require the use of spliced large pixel image sensors, the choice of BSI technology in the market is very limited. Therefore, X-FAB has added BSI functionality to the previously acclaimed CMOS sensor process platform XS018, bringing new possibilities to different segmented markets. Whether it is X-ray diagnostic equipment, industrial automation systems, astronomical research, robot navigation, car mounted front facing cameras, etc., customers can easily meet the most stringent application needs.

The XS018 CMOS sensor platform has the characteristics of fast readout speed and low dark current. Customers can also choose a variety of different epitaxial layer thicknesses on the platform to achieve image sensors for different application scenarios. In addition, through the BSI process, customers can also choose to add ARC layers and adjust them according to different special application requirements. The accompanying X-FAB design support package covers the complete workflow from initial design to engineering sample shipment, including a comprehensive PDK.

"BSI technology is increasingly widely used in modern imaging devices because it can place photosensitive components closer to the light source and avoid unnecessary circuit obstacles to improve image imaging capabilities. It has been proven to be very useful in low light environments." Heming Wei, Marketing Manager of X-FAB Optical Sensor Technology, said, "Although such applications were mainly concentrated in the consumer electronics field before, there is also a large demand in the industrial, automotive, and medical markets. With the help of X-FAB's BSI process, higher sensitivity, larger sensor size, and pixel capacity advantages can be combined to launch convincing products in the market, which can better meet the different application needs of industry, automotive, and medical."

Abbreviations:

ARC anti reflective coating

BSI Backlighting Technology

CMOS complementary metal oxide semiconductor

PDK Process Design Kit

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