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On June 4, 2025, Da Da Da Lian Holdings, an internationally leading semiconductor component distributor dedicated to the Asia Pacific market, announced that its subsidiary Shiping has launched a Klipper 3D printer solution with NXP RT1050 MCU as the core, supplemented by Winbond W25Q80 Flash, Novosense NSD7312 H-bridge driver IC, SGMicro SGM8651 operational amplifier, SGM61410 synchronous voltage regulator, SGM2059 LDO regulator, and JOULWATT JWH5141F synchronous voltage regulator.
3D printers, also known as additive manufacturing technology, are a technique that utilizes digital model files to construct objects by stacking materials layer by layer. In use, users only need to import design files to transform their ideas into any entity within a few hours, truly achieving "what you see is what you get" flexible manufacturing. Currently, most consumer grade printers use Klipper as their 3D printing firmware. Unlike traditional Marlin firmware, Klipper adopts an execution logic separation architecture, where the MPU is responsible for logical operations and the MCU is responsible for execution, enabling higher printing speed and quality. To promote the application of 3D printers, Dalian University has launched the Klipper 3D printer solution with NXP RT1050 MCU as the core, supplemented by Huabang Electronics W25Q80 Flash, Nanochip NSD7312 H-bridge driver IC, Shengbang Micro SGM8651 operational amplifier, SGM61410 synchronous voltage regulator, SGM2059 LDO regulator, and Jewate JWH5141F synchronous voltage regulator.
This scheme consists of three parts: MCU board, driver board, and bottom board. The MCU board adopts NXP RT1050 MCU and W25Q80 Flash from Huabang Electronics. Among them, the NXP RT1050 is based on the Arm Cortex-M7 core, with a clock speed of up to 600MHz, and is equipped with 512KB of SRAM, providing ease of use and real-time functionality. Huabang Electronics W25Q80 Flash has strong reading performance and smaller appearance size, which can meet the needs of edge computing in industrial and consumer application scenarios.
The driver board consists of two nano core micro NSD7312 H-bridge driver ICs and two Saint Bang micro SGM8651 operational amplifiers. Nanochip NSD7312 is a DC brushed motor driver chip with built-in power N-MOSFET and provides various functions such as power undervoltage protection, overcurrent protection, and over temperature protection for power stages. In addition, the product can provide a peak current of 3.6A and supports PWM current modulation function, which can effectively reduce the demand for input capacitance during motor start-up and stalling. Shengbang Micro SGM8651 is a high-precision, low-noise, and low distortion voltage feedback operational amplifier with a high gain bandwidth of 50MHz and a fast conversion rate of 66V/μ s. It can process high-speed signals and respond quickly to changes.
The base plate adopts the Shengbang Micro SGM61410 synchronous voltage regulator, SGM2059 LDO regulator, and Jewate JWH5141F synchronous voltage regulator. Among them, SGM61410 synchronous buck regulator outputs up to 600mA of current within a wide input voltage range of 5V to 42V. It is suitable for various high input voltage industrial or automotive applications. In addition, its low static current of 14 μ A and ultra-low turn off current of only 0.6 μ A make it an ideal choice for battery powered applications. SGM2059 is a low VIN, ultra-low noise, high PSRR, low dropout linear regulator. Its working input voltage range is 1.1V to 5.5V, suitable for applications that require low-noise and fast transient response power supply. JWH5141F is a high-performance synchronous voltage regulator with multiple protection functions to ensure the reliability of the system.
Thanks to the high performance and flexible design of the product, this solution only requires one MCU to process the motion commands transmitted from the Klipper upper computer and drive four stepper motors simultaneously, saving the number of motor drive chips and having a high cost-effectiveness advantage.
Core technological advantages:
One MCU simultaneously controls four stepper motors and runs the Klipper lower computer;
The stepper motor operates silently and at high speed.
Scheme specifications:
The NSD7312 (Nanochip Micro) H-bridge driver with integrated Driver and MOSFET is used, with a rated current of 1.5A and high integration of the driving circuit;
MCU integrates eFlex PWM, which can output multiple PWM signals, facilitating the control of magnetic field vectors for multiple motors;
Two PWM circuits are used to control the fan speed (extrusion head and model cooling) separately;
Two NTC channels are used to sample the temperature of the extrusion head and hot bed.
This news mainly comes from Da Da Da Tong:
Shiping Group's Klipper 3D Printer Solution Based on NXP RT1050
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Regarding Dahua University Holdings:
Da Da Da Da Da Holdings is an internationally leading semiconductor component distributor dedicated to the Asia Pacific market. It was founded in 2005 and celebrates its 20th anniversary this year. Headquartered in Taipei, it has subsidiaries such as Shiping, Pinjia, Quanding, and Youshang, with approximately 5000 employees and over 250 authorized product suppliers. It has 69 service centers worldwide and achieved a revenue of NT $8805.5 billion in 2024. Dahua University has established an industrial holding platform, focusing on international operational scale and localized flexibility, and has long been deeply rooted in the Asia Pacific market. With the vision of becoming the "industry's preferred channel benchmark", it fully implements the core values of "team, integrity, professionalism, and efficiency", and has won the "Global Distributor Excellence Performance Award" for 24 consecutive years. At the same time, it continues to strengthen ESG sustainable development and has won international recognition and MSCI ESG rating of A for 3 consecutive years. Faced with the trend of new manufacturing, Dalian University is committed to transforming into a data-driven enterprise, establishing an online digital platform - "DaDaWang", and advocating the intelligent logistics service (LaaS, Logistics as a Service) model to assist customers in facing the challenges of intelligent manufacturing together. Starting from benevolence, building trust through technology, and adhering to the corporate mission of "co creating partner value to achieve the future", Dalian University hopes to build a competitive ecosystem with the industry "La Bang Jie Pai".
This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry
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Media Relations
Name: John Chen
Email: salesdept@topcomponents.ru